SOCAMM is not a repackaging of existing hardware or a solution in search of a problem. Rather, it’s addressing real problems and is needed and wanted by the industry, said Jim Handy, president of Objective Analysis.
“The server processor manufacturers and Nvidia are really behind SOCAMM because of the fact that they [gain] a faster interface and it gets a lot of memory into a small area with a little bit lower power consumption,” he said.
As previously noted, SOCAMM2 uses stacked memory, which can be more expensive to manufacture, but Handy says that’s not the case. “[Memory vendors] sell different stack configurations for the same price as these DRAM guys, and they are using the same packaging technology that the NAND flash guys do, so I wouldn’t expect there to be any noticeable price difference,” he said.
SK Hynix, another major memory manufacturer on the market, has also announced plans to support SOCAMM2 memory but has not given any release details and is believed to be behind Micron and Samsung. SOCAMM2 is expected to launch around the second quarter of 2026 when Nvidia launches its Vera Rubin platform.
